At ASMPT AMICRA GmbH, we continuously strive to provide our valued customers with extraordinary, high-technological engineering services & products for the whole industry field of microelectronics, specifically including the areas of:
ASMPT AMICRA GmbH has developed advanced features and capabilities to support specific Advanced Packaging Markets in the backend assemble arena. ASMPT AMICRA’s Die Attach solutions continue to enable the advanced packaging market to push the boundaries forward and beyond. These unique innovative solutions enable our customer base to achieve some of the most accurate die placement performance in the world today while maintaining bonding rates that are 2x and 3x faster than our closest competitor of the markets we serve, resulting in a value proposition that is second to none.
Please visit our Products page for more specific information or contact us at email@example.com with any questions you may have - we would be happy to assist you!