Regensburg, August 18th, 2025 – ASMPT will be present when the ECOC 2025 Exhibition, Europe’s leading trade fair for optical communication, opens its doors in Copenhagen from September 29 to October 1. At Booth 1131 in Hall C of the Bella Center, the global market and technology leader in hardware and software solutions for semiconductor and electronics production will present forward-looking technologies for silicon photonics and co-packaged optics (CPO). The premiere of the MEGA-P multi-chip bonder will be a special highlight at the ASMPT booth.
Regensburg, Germany, March 12, 2024 - ASMPT AMICRA is excited to announce its participation in OFC 2024, showcasing its commitment to the optical communications industry and its expanding presence in the market. They will present the revolutionary Co-Packaged Optics (CPO) solution aimed at enhancing bandwidth density, energy efficiency, and connectivity in data centers. OFC 2024 will take place from March 26th to 28th at the renowned San Diego Convention Center in California, USA.
ASMPT AMICRA has been awarded the TOP 100 seal 2022, in the 29th round of the prestigious TOP 100 innovation competition, with the award presented only to the most innovative medium-sized companies.
An article featuring ASM AMICRA's NOVA+ MTP System and X-Celeprint's MTP technology can be found in the Semiconductor Digest’s August/September 2021 issue, p. 9-11.
Proven MTP technology enables massively-parallel pick-and-place of large arrays of ultra-thin chips, bringing new heterogeneous integration capabilities for 3D ICs
Thanks to all visitors who stopped by our booth at the world’s leading optoelectronic event CIOE (China International Optoelectronic Exposition) 2020 in Shenzhen!
ASM AMICRA is being featured in an article on "Novus Light Technologies Today",
ASM AMICRA Microtechnologies GmbH wins the 2019 Productronica Innovation Award for its newly developed CoS (Chip-on-Submount) die-bonder.
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