An article featuring ASM AMICRA's NOVA+ MTP System and X-Celeprint's MTP technology can be found in the Semiconductor Digest’s August/September 2021 issue, p. 9-11.
Proven MTP technology enables massively-parallel pick-and-place of large arrays of ultra-thin chips, bringing new heterogeneous integration capabilities for 3D ICs
Thanks to all visitors who stopped by our booth at the world’s leading optoelectronic event CIOE (China International Optoelectronic Exposition) 2020 in Shenzhen!
ASM AMICRA is being featured in an article on "Novus Light Technologies Today",
We are looking forward to returning again to exhibit at the OFC- Optical Fiber Communication Exhibition,
ASM AMICRA Microtechnologies GmbH wins the 2019 Productronica Innovation Award for its newly developed CoS (Chip-on-Submount) die-bonder.
ASMPT AMICRA has been awarded the TOP 100 seal 2022, in the 29th round of the prestigious TOP 100 innovation competition, with the award presented only to the most innovative medium-sized companies.