ASM AMICRA Unveils Industry’s First Manufacturing Systems Incorporating X-Celeprint’s MTP Technology for High Volume Heterogeneous Integration of Ultra-Thin Chips


Proven MTP technology enables massively-parallel pick-and-place of large arrays of ultra-thin chips, bringing new heterogeneous integration capabilities for 3D ICs

REGENSBURG, GERMANY; CORK, IRELAND and RESEARCH TRIANGLE PARK, NC (April 26, 2021) – ASM AMICRA Microtechnologies GmbH (“ASM AMICRA”), a subsidiary of ASM Pacific Technology Limited, announced three new manufacturing systems that combine X-Celeprint’s Micro-Transfer Printing (MTP) and ASM AMICRA’s high precision die bonding technology to introduce the semiconductor industry’s first complete system to enable high volume heterogeneous integration of ultra-thin dies onto up to 300mm base wafers.

X-Celeprint’s MTP process stacks ultra-thin dies known as ‘x-chips’, which can be extremely varied[1] and made using very different process nodes and technologies[2], to create virtually monolithic 3D ICs that improve power, performance, area, cost, time-to-market and security for a wide array of applications including high-performance computing, communications, mobile, automotive, industrial, medical, or defense systems.

ASM AMICRA has been perfecting ultra-high precision placement technology for almost 20 years, and has now incorporated X-Celeprint’s MTP technology into three different manufacturing systems. These are:

  • The Nova+ MTP system, which serves high throughput needs with a fully automatic ISO 4 clean room class system using a 50x50mm MTP stamp enabling massively parallel pick-and-place of x-chips. Placement accuracy is +/- 1.5-microns with a 40-second cycle time.
  • The NANO MTP system, which serves markets such as photonics that require more precise placement accuracy (plus-or-minus 0.3-microns).
  • The AFC+ MTP system, which serves R&D and low volume manufacturing markets. Placement accuracy is plus-or-minus 1.0-microns with a 50-second cycle time.

X-Celeprint and ASM AMICRA are facilitating the adoption of MTP technology through development support, including design consultation with assistance in optimizing design and processes and prototyping services to ensure successful product launches. An extensive network of suppliers, manufacturers, and researchers are available to support customer project needs, including licensing programs.

“This agreement with X-Celeprint brings revolutionary technology to market for photonics and 3D heterogeneous integration,” said Dr. Johann Weinhändler, Managing Director, ASM AMICRA Microtechnologies GmbH. “MTP technology offers efficient handling of high volumes of large arrays of ultra-thin, brittle dies, as well as the ability to integrate dies from several different source wafers. MTP technology will provide semiconductor manufacturers with a critical, additional ‘tool in the toolbox’ that supplements conventional and advanced packaging technology.”

“The ultra-high precision capabilities of ASM AMICRA’s MTP manufacturing systems for heterogeneous integration of large arrays of ultra-thin x-chips has the potential to be a game-changer for semiconductor manufacturers seeking to extend Moore’s Law with 3D IC heterogeneous integration,” said Kyle Benkendorfer, X-Celeprint’s CEO. “Enabling chip designers to combine the optimum materials and different process technologies in 3D ICs results in more powerful devices, with higher density, increased functionality, lower cost, higher yield, and faster time to market.”

[1] X-chips can consist of various combinations of RF and power transistors, hardware assurance features, photonics, sensors, capacitors, inductors, filters, and antennas, just to name a few.

[2] These processes include SOI, GaN, GaAs, InP and SiGe, among others.


ASM AMICRA Microtechnologies GmbH is a worldwide leading supplier for ultra-high precision die attach systems. The AMICRA systems specialize in submicron placement accuracy to ±0.3µm@3s for the photonics and semiconductor market. The systems also support die attach, flip chip, eutectic, epoxy, and X-Celeprint’s Micro Transfer Printing (MTP) processes. Markets served include silicon photonics, optoelectronics, active optical cable (AOC), VCSELs, laser diodes, 2.5D/3D ICs, wafer level packaging (WLP), large panel fan-out/embedded wafer level packaging (EWLP), and automotive sensors/LiDAR. Headquartered in Regensburg, Germany, ASM AMICRA has worldwide sales and support locations.

ASM AMICRA is a subsidiary of ASMPT Limited (HKEX stock code: 0522), a leading global supplier of hardware and software solutions for the manufacture of semiconductors and electronics that is headquartered in Singapore.

About X-Celeprint, Ltd.

X-Celeprint licenses MTP technology, which consists of more than 300 worldwide patents and 189 pending applications, to support semiconductor manufacturers in adopting MTP. X-Celeprint is co-located with Micross, which has a Trusted/ITAR-compliant 200mm wafer fab with extensive heterogeneous capabilities, in Research Triangle Park, North Carolina, and Tyndall National Institute in Cork, Ireland. Both facilities have MTP technology in their R&D advanced packaging lines for supporting customers with rapid prototyping. X-Celeprint has research partnerships with academic centers, including the University of Illinois Urbana Champaign and the University of Ghent / imec.

ASM AMICRA Microtechnologies GmbH

Dr. Johann Weinhaendler, Managing Director

+49 941 2082090

X-Celeprint, Ltd.

Bob Conner, Vice President, New Application Business Development

+1 (919) 757-6825

For media enquiries:

Lim Ee Guan

Director, Corporate Communications

ASM Pacific Technology Limited

Tel: +65 6450 1445

On behalf of X-Celeprint, Ltd.:

Chris Burke

President, BTB Integrated Marketing

+1 (919) 872-8172

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