Nova Plus - Die Bonder and Flip Chip Bonder

ASMPT AMICRA's highly accurate die bonder / flip chip bonder system (+/-1,5 µm), with multi-chip capability, a modular machine concept and much more!

The Nova Plus Die Bonder / Flip Chip Bonder has a wide range of features including the following:

  • high precision die bonder / flip chip bonder
  • accuracy +/- 1.5 µm @ 3s
  • a cycle- time of < 3 sec
  • modular machine concept for all micro assembly applications
  • eutectic bonding via diode-laser, a heating plate or epoxy stamping and dispensing
  • multi flip chip bonding
  • wafer mapping
  • post bond inspection/ measurement
  • substrate working area of 550 x 600 mm
  • active bond-force-control

Autoloading for up to:

  • 12" wafers
  • 300 mm wafers
  • 450 mm substrate wafers

Optional:

  • UV- Curing
  • Dispensing
  • And more


The Nova Plus Die Bonder / Flip Chip Bonder is designed for the following markets:

  • Semiconductor advanced packaging- (TSV, eWLB, Fan-Out, WLP, 3D, Stack Die)
  • MEMS
  • Automotive Sensors
  • RFID
  • LED
  • Optoelectronic

For questions regarding the NovaPlus Die Bonder / Flip Chip Bonder, please contact our worldwide support team.

For a more detailed written description, please read below….

ASMPT AMICRA’s AFCPlus is one of the most advanced die bonding systems on the market today. It is uncommon to find a precision die bonder that can maintain a placement accuracy down to ±1µm @ 3s while bonding with temperatures exceeding 350°C and while also applying high bonding forces. In many cases this type of die bonding can be classified as thermocompression Bonding or TCB. And in other cases these capabilities are also required for through silicon via or TSV. As a larger category of Advanced Packaging Die Attach, the AFCPlus is considered one of the most flexible Die Bonders on the market today.

The AFCPlus can not only accommodate all the necessary features of an Advanced Packaging Die Bonding System it can also fulfill all the key requirements for the Optoelectronic market including the up and coming Silicon Photonics market. This market includes die bonding VSCEL and Laser Diode die, Photo Diode Die, and Lens Attach with UV curable adhesives. This precision die attach method includes in-situ bonding and eutectic die bonding. These types of die attach are necessary to produce Active Optical Cable assemblies, AOC and transceiver type packages. The AFCPlus high accuracy die bonder ensures its placement accuracy by providing a unique dynamic alignment method along with a laser based substrate heating technology.

In conclusion, if a die bonding technologist is looking for Flip Chip, 3D IC / 2.5D IC, TCB, TSV, Chip on Chip, Chip on Wafer, Chip on Substrate, Optoelectronic, AOC, Lens Attach, MCM, Advanced Packaging Epoxy Die Attach, Eutectic In-stu Die Attach, MEMS or Sensor Die Attach, WLP, eWLP, etc….the AFCPlus or the NOVAPlus is your best choice!

Product Catalog

Brochures can be downloaded, upon receipt of contact details

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