Regensburg, Germany, March 12, 2024 - ASMPT AMICRA is excited to announce its participation in OFC 2024, showcasing its commitment to the optical communications industry and its expanding presence in the market. They will present the revolutionary Co-Packaged Optics (CPO) solution aimed at enhancing bandwidth density, energy efficiency, and connectivity in data centers. OFC 2024 will take place from March 26th to 28th at the renowned San Diego Convention Center in California, USA.
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ASMPT AMICRA ist in der 29. Runde des renommierten Innovationswettbewerbs TOP 100 mit dem TOP 100-Siegel 2022 ausgezeichnet worden, das nur an die innovativsten mittelständischen Unternehmen verliehen wird.
Panel-Level Heterogeneous Integration Technology for Analog ICs
Proven MTP technology enables massively-parallel pick-and-place of large arrays of ultra-thin chips, bringing new heterogeneous integration capabilities for 3D ICs
Thanks to all visitors who stopped by our booth at the world’s leading optoelectronic event CIOE (China International Optoelectronic Exposition) 2020 in Shenzhen!
ASM AMICRA is being featured in an article on "Novus Light Technologies Today",
We are looking forward to returning again to exhibit at the OFC- Optical Fiber Communication Exhibition,
ASM AMICRA Microtechnologies GmbH wins the 2019 Productronica Innovation Award for its newly developed CoS (Chip-on-Submount) die-bonder.
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