CoS Die Bonder

ASMPT AMICRA's fully automatic, die bonder / flip chip bonder with exceptionally high precision and placement accuracy (±1.5µm), a cycle time of <15 sec. as well as a modular machine concept, a flip chip option and much more.

More informationen

AFC Plus - Die Bonder und Flip Chip Bonder

ASMPT AMICRA's fully automatic, die bonder / flip chip bonder with exceptionally high precision and placement accuracy (±1µm), a cycle time of <15 sec. as well as a modular machine concept, a flip chip option and much more.

More informationen

Nova Plus - Die Bonder und Flip Chip Bonder

ASMPT AMICRA's highly accurate die bonder / flip chip bonder system (+/-1,5 µm), with multi-chip capability, a modular machine concept and much more!

More informationen

NANO - Die Bonder und Flip Chip Bonder

ASM AMICRA’s ultra-precision die bonder / flip chip bonder which supports ± 0.2µm @ 3s placement accuracy, offering the highest placement accuracy in its class!

More informationen

High Speed Dispense Systems

ASM AMICRA's Fully Automatic Inline High Speed Reel to Reel, Lead or Frame Dispensing Line

More informationen

In order to be able to use all functions of this website,
either a login or a registration is necessary.

Login Register