More than Precision: Die Bonder / Flip Chip Bonder Systems - Dispense & Test Systems - Wafer Inking Solutions and more!

The rapidly fast-growing micro-electronic market demands immediate reaction and advanced engineering know-how. Under the management of Dr. Johann Weinhaendler, Horst Lapsien and Rudolf Kaiser, working together along with our dedicated team of highly experienced, creative technical and manufacturing professionals, we have collected more than 15 years of knowledge in all kinds of advanced micro assembly solutions.

Our earned expertise and experience allows ASMPT AMICRA GmbH to provide customers with state-of-the-art, high-tech products. Our team develops the systems with modern development tools focusing on:

  • Concept development
  • 3D construction
  • Development of prototype systems
  • Precision assembly
  • Software development
  • Customized machine controls
  • Process vision systems
  • Image processing systems
  • Process development and process production transfer
  • Sampling and small volume production.

With the headquarters located in picturesque, Regensburg, Germany, ASMPT AMICRA GmbH has developed an unsurpassed capability of offering leading edge solutions to customers in multiple segments of the microelectronic industry. We also have sales representatives available worldwide in Asia, Europe and throughout the USA. Click on the "Products" tab above to learn more about our die bonders and flip chip bonders as well as dispense & test systems.

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