☰ Menu
ASMPT AMICRA
|
English
German
☰ Menu
ASMPT AMICRA
Home
Company
Management
Applications
Products
Contact
News
Jobs
Back
Company
Core Strengths
History
Back
Management
Horst Lapsien
Rudolf Kaiser
Dr. Johann Weinhändler
Back
Applications
SiPhotonics/PIC
3D IC, TSV and TCB
Active Optical Cable (AOC)
FanOut
Back
Products
Die Flip Chip Bonder
High Speed Dispense Systems
Back
Die Flip Chip Bonder
CoS Die Bonder: High-precision chip-on-substrate bonding
AFC Plus - Die Bonder and Flip Chip Bonder
Nova Plus - Die Bonder and Flip Chip Bonder
NANO - Die Bonder and Flip Chip Bonder
Back
High Speed Dispense Systems
High Speed & Precision Dispensing System
Horst Lapsien
Managing Director
Info
Rudolf Kaiser
Managing Director
Info
Dr. Johann Weinhändler
Managing Director
Info
In order to be able to use all functions of this website,
either a login or a registration is necessary.
Login
Register