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Management
Horst Lapsien
Dr. Johann Weinhändler
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Applications
SiPhotonics/PIC
3D IC, TSV and TCB
Active Optical Cable (AOC)
FanOut
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Products
Die Flip Chip Bonder
High Speed Dispense Systems
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Die Flip Chip Bonder
CoS Die Bonder: High-precision chip-on-substrate bonding
NOVA Pro - Die Bonder and Flip Chip Bonder
NANO - Die Bonder and Flip Chip Bonder
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High Speed Dispense Systems
High Speed & Precision Dispensing System
Horst Lapsien
Managing Director
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Dr. Johann Weinhändler
Managing Director
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