History

2021

• CoS^Pro and NOVA^Pro product launch
• Trade Show Participation: OFC (USA); SEMICON China (China); ECOC (France); CIOE (China); productronica (Munich, Germany)

2020

• Trade Show Participation: NEPCON Japan (Japan); OFC (USA); CIOE (China)

2019

• ASM AMICRA CoS wins the Productronica Innovation Award
• Trade Show Participation: OFC (USA); SEMICON Korea (South Korea); SEMICON China (China); EPIC Inhouse at ASM AMICRA (Regensburg, Germany); IMAPS International Device Packaging Exhibition (USA); SEMICON West (USA); ECOC (Ireland); CIOE (China); productronica (Munich, Germany)

2018

• Aquired by ASMPT and have been renamed to ASM AMICRA Microtechnologies GmbH
• Trade Show Participation: Nepcon Japan (Japan); SEMICON Korea (South Korea); IMAPS International Device Packaging Exhibition (USA); OFC (USA); ECTC (USA); ECOC (Italy); CIOE (China); CIIE (China)

2017

• Official product launch of the NANO Die Bonder and Flip Chip Bonder
• Opening of new headquarters at Marie-Curie-Str. 6 in Regensburg, Germany
• Became a member of the EPIC Association
• Trade Show Participation: European 3D TSV Summit (France); IMAPS International Device Packaging Exhibition (USA); OFC (USA); Nepcon (South Korea); SEMICON Southeast Asia (Malaysia); ECTC (USA); SEMICON West (USA); CIOE (China); SEMICON Taiwan (China/Taiwan); ECOC (Sweden); IMAPS (USA), IWLPC (USA); productronica (Munich/Germany); SEMICON Japan (Japan)

2016

• Kanematsu PWS LTD.,is added to our Asian sales representatives team, covering Japan
• Trade Show Participation: European 3D TSV Summit; IMAPS International Device Packaging Exhibition (USA); OFC (USA); ECTC (USA); SEMICON West (USA); CIOE (China); SEMI Taiwan (China/Taiwan); ECOC (Düsseldorf/Germany); IMAPS (USA); IWLPC (USA)

2015

• Introduction of HDS (High Speed Dispense System)
• Trade Show Participation: European 3D TSV Summit; IMAPS International Device Packaging Exhibition 2015 (USA); OFC (USA); SEMICON Southeast Asia (Malaysia); ECTC (USA); SEMICON West (USA); CIOE (China); SEMICON Taiwan (China/Taiwan); ECOC (Spain); IMAPS (USA), IWLPC (USA); productronica (Munich/Germany)

2014

• October
  • Mr. Joe Ettipio joins the AMICRA Sales Management team as Regional Sales Manager- USA/Canada Western Region (See news story Oct. 1, 2014)
• July
  • Globaltech Automation is added to our Asian sales representatives team, covering the region of the Philippines
• January:
  • Mr. David R. Halk joins the AMICRA Sales Management team as Regional Sales Manager- USA
  • PAiTECH Co., Ltd is announced as the new Sales Distributor for Israel
• Trade Show Participation: SEMICON Korea (South Korea); OFC (USA); IMAPS Int. Exhibition on Device Packaging (USA)

2013

• September: Founding of AMICRA PTE Ltd. in Singapore.
• July: The first system sale to the HDD market is signed with a major European LD manufacturer.
• May/June: A second location is added in Regensburg during the 2nd quarter of the year
• Trade Show Participation: SEMICON Taiwan (China/Taiwan); SEMICON West (USA); OFC (USA); IWLPC (USA); productronica (Munich, Germany)

2012

• Delivery of the first LTS Test System and 12" Wafer Inking System.
• Received the first orders from a major Taiwanese Semiconductor Packaging house for a large area Fan-Out application.
• Multiple system installations at a major optoelectronic packaging house in Thailand.
• Trade Show Participation: SMT Hybrid Packaging (Nuremberg, Germany); OFC (USA)

2011

• Increased number of employees from 35 to 48.
• Start of product development for the LTS (LED & LD) Test system and the 12" Wafer Inking System.
• Successful product launch of the new AFC^Plus High Precision Die Bonder.
• Acquisition of five new customers in Asia and Europe.
• Trade Show Participation: SEMICON Taiwan (China/Taiwan); SMT (Nuremberg, Germany); OFC (USA)

2010

• Product launch of the new NOVA^Plus High Precision Die Bonder.
• Largest incoming orders in the company's history.
• Received the first orders from Taiwan.
• Dr. Weinhaendler signed five new distribution and representation agreements with trading partners.
• Trade Show Participation: SEMICON Taiwan (China/Taiwan), SMT (Nuremberg, Germany), OFC (USA)

2009

• September:
  • Execution of an exclusive distribution agreement with Schmidtek Ltd. for the Taiwan sales territory
• June :
  • Execution of an exclusive distribution agreement with Caleo S.A. for the France, Spain, Portugal, and Morocco sales territories.
  • Execution of an exclusive distribution agreement with Interelec AG for the Switzerland sales territory.
• April :
  • Execution of a distribution agreement with WKK for the Singapore, Malaysia, and Thailand sales territories.
• February :
  • Dr. Johann Weinhaendler joins the management team as head of sales, marketing and business development.
• Trade Show Participation: OFC (USA); SMT (Nuremberg, Germany); SEMICON Singapore (Singapore); productronica (Munich, Germany)

2008

• December:
  • Reconstruction of the company's ownership structure along with recapitalization takes place
• August:
  • New company headquarters is stationed at Wernerwerkstr. 4, Regensburg, Germany
• 2 AFC die bonders for MEMS Probecard (Korea)
• Follow-up orders for AFC Flip Chip
• Follow-up orders for the laser process system (LPS)
• Trade Show Participation: OFC (USA); SMT; SEMICON Taiwan (China/Taiwan)

2007

• Dispenser production line for pressure sensors is completed
• Order for AFC Flip Chip (Canada) is placed
• Follow-up orders for AIS are requested
• Development of the laser lift off system (LPS)
• Trade Show Participation: SMT; Laser 2007; productronica (Munich, Germany)

2006

• Delivery of a completed production line for High Speed Die Bonder NOVA
• Follow-up orders for AIS
• Process development of bubble-free silicon membrane
• Automatic measuring system for silicon membrane
• Trade Show Participation: SMT; Optatec

2005

• Development of the AIS (high speed inking with wafer robot)
• Commencement of development of the high speed die bonder
• Trade Show Participation: Laser 2005; SMT; productronica (Munich, Germany)

2004

• Development of the AFC Flip Chip
• Development of a fully automatic lens characterization system
• Trade Show Participation: Hannover Messe (Hannover Trade Fair) (Microsystems Technology); SMT

2003

• Development of the HIGH SPEED Wafer Inking System
• Development of the AFC Flip Chip
• Trade Show Participation: SMT; Laser 2003; productronica (Munich, Germany)

2001 / 2002

• Establishment of AMICRA Microtechnologies GmbH by Rudolf Kaiser and Horst Lapsien
• Development of ADB2000 und SDB1000
• Trade Show Participation: ECOC 2001 Amsterdam; ECOC 2002 Copenhagen