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ASMPT AMICRA
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Company
Core Strengths
History
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Management
Horst Lapsien
Rudolf Kaiser
Dr. Johann Weinhändler
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Applications
SiPhotonics/PIC
3D IC, TSV and TCB
Active Optical Cable (AOC)
FanOut
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Products
Die Flip Chip Bonder
High Speed Dispense Systems
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Die Flip Chip Bonder
CoS Die Bonder: High-precision chip-on-substrate bonding
AFC Plus - Die Bonder and Flip Chip Bonder
Nova Plus - Die Bonder and Flip Chip Bonder
NANO - Die Bonder and Flip Chip Bonder
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High Speed Dispense Systems
High Speed & Precision Dispensing System
History
2021
CoS
Pro
and NOVA
Pro
product launch
Trade Show Participation:
OFC (USA); SEMICON China (China); ECOC (France); CIOE (China); productronica (Munich, Germany)
2020
Trade Show Participation:
NEPCON Japan (Japan); OFC (USA); CIOE (China)
2019
ASM AMICRA CoS wins the Productronica Innovation Award
Trade Show Participation:
OFC (USA); SEMICON Korea (South Korea); SEMICON China (China); EPIC Inhouse at ASM AMICRA (Regensburg, Germany); IMAPS International Device Packaging Exhibition (USA); SEMICON West (USA); ECOC (Ireland); CIOE (China); productronica (Munich, Germany)
2018
Aquired by ASMPT and have been renamed to
ASM AMICRA Microtechnologies GmbH
Trade Show Participation:
Nepcon Japan (Japan); SEMICON Korea (South Korea); IMAPS International Device Packaging Exhibition (USA); OFC (USA); ECTC (USA); ECOC (Italy); CIOE (China); CIIE (China)
2017
Official product launch of the
NANO
Die Bonder and Flip Chip Bonder
Opening of new headquarters at Marie-Curie-Str. 6 in Regensburg, Germany
Became a member of the
EPIC Association
Trade Show Participation:
European 3D TSV Summit (France); IMAPS International Device Packaging Exhibition (USA); OFC (USA); Nepcon (South Korea); SEMICON Southeast Asia (Malaysia); ECTC (USA); SEMICON West (USA); CIOE (China); SEMICON Taiwan (China/Taiwan); ECOC (Sweden); IMAPS (USA), IWLPC (USA); productronica (Munich/Germany); SEMICON Japan (Japan)
2016
Kanematsu PWS LTD.
,is added to our Asian sales representatives team, covering Japan
Trade Show Participation:
European 3D TSV Summit; IMAPS International Device Packaging Exhibition (USA); OFC (USA); ECTC (USA); SEMICON West (USA); CIOE (China); SEMI Taiwan (China/Taiwan); ECOC (Düsseldorf/Germany); IMAPS (USA); IWLPC (USA)
2015
Introduction of
HDS
(High Speed Dispense System)
Trade Show Participation:
European 3D TSV Summit; IMAPS International Device Packaging Exhibition 2015 (USA); OFC (USA); SEMICON Southeast Asia (Malaysia); ECTC (USA); SEMICON West (USA); CIOE (China); SEMICON Taiwan (China/Taiwan); ECOC (Spain); IMAPS (USA), IWLPC (USA); productronica (Munich/Germany)
2014
October
Mr. Joe Ettipio joins the AMICRA Sales Management team as Regional Sales Manager- USA/Canada Western Region (See news story Oct. 1, 2014)
July
Globaltech Automation
is added to our Asian sales representatives team, covering the region of the Philippines
January:
Mr. David R. Halk joins the AMICRA Sales Management team as Regional Sales Manager- USA
PAiTECH Co., Ltd is announced as the new Sales Distributor for Israel
Trade Show Participation:
SEMICON Korea (South Korea); OFC (USA); IMAPS Int. Exhibition on Device Packaging (USA)
2013
September: Founding of AMICRA PTE Ltd. in Singapore.
July: The first system sale to the HDD market is signed with a major European LD manufacturer.
May/June: A second location is added in Regensburg during the 2nd quarter of the year
Trade Show Participation:
SEMICON Taiwan (China/Taiwan); SEMICON West (USA); OFC (USA); IWLPC (USA); productronica (Munich, Germany)
2012
Delivery of the first LTS Test System and 12" Wafer Inking System.
Received the first orders from a major Taiwanese Semiconductor Packaging house for a large area Fan-Out application.
Multiple system installations at a major optoelectronic packaging house in Thailand.
Trade Show Participation:
SMT Hybrid Packaging (Nuremberg, Germany); OFC (USA)
2011
Increased number of employees from 35 to 48.
Start of product development for the LTS (LED & LD) Test system and the 12" Wafer Inking System.
Successful product launch of the new
AFC
Plus
High Precision Die Bonder.
Acquisition of five new customers in Asia and Europe.
Trade Show Participation:
SEMICON Taiwan (China/Taiwan); SMT (Nuremberg, Germany); OFC (USA)
2010
Product launch of the new
NOVA
Plus
High Precision Die Bonder.
Largest incoming orders in the company's history.
Received the first orders from Taiwan.
Dr. Weinhaendler signed five new distribution and representation agreements with trading partners.
Trade Show Participation:
SEMICON Taiwan (China/Taiwan), SMT (Nuremberg, Germany), OFC (USA)
2009
September:
Execution of an exclusive distribution agreement with Schmidtek Ltd. for the Taiwan sales territory
June :
Execution of an exclusive distribution agreement with Caleo S.A. for the France, Spain, Portugal, and Morocco sales territories.
Execution of an exclusive distribution agreement with Interelec AG for the Switzerland sales territory.
April :
Execution of a distribution agreement with WKK for the Singapore, Malaysia, and Thailand sales territories.
February :
Dr. Johann Weinhaendler
joins the management team as head of sales, marketing and business development.
Trade Show Participation:
OFC (USA); SMT (Nuremberg, Germany); SEMICON Singapore (Singapore); productronica (Munich, Germany)
2008
December:
Reconstruction of the company's ownership structure along with recapitalization takes place
August:
New company headquarters is stationed at Wernerwerkstr. 4, Regensburg, Germany
2 AFC die bonders for MEMS Probecard (Korea)
Follow-up orders for AFC Flip Chip
Follow-up orders for the laser process system (LPS)
Trade Show Participation:
OFC (USA); SMT; SEMICON Taiwan (China/Taiwan)
2007
Dispenser production line for pressure sensors is completed
Order for AFC Flip Chip (Canada) is placed
Follow-up orders for AIS are requested
Development of the laser lift off system (LPS)
Trade Show Participation:
SMT; Laser 2007; productronica (Munich, Germany)
2006
Delivery of a completed production line for High Speed Die Bonder NOVA
Follow-up orders for AIS
Process development of bubble-free silicon membrane
Automatic measuring system for silicon membrane
Trade Show Participation:
SMT; Optatec
2005
Development of the AIS (high speed inking with wafer robot)
Commencement of development of the high speed die bonder
Trade Show Participation:
Laser 2005; SMT; productronica (Munich, Germany)
2004
Development of the AFC Flip Chip
Development of a fully automatic lens characterization system
Trade Show Participation:
Hannover Messe (Hannover Trade Fair) (Microsystems Technology); SMT
2003
Development of the HIGH SPEED Wafer Inking System
Development of the AFC Flip Chip
Trade Show Participation:
SMT; Laser 2003; productronica (Munich, Germany)
2001 / 2002
Establishment of
AMICRA Microtechnologies GmbH
by Rudolf Kaiser and Horst Lapsien
Development of ADB2000 und SDB1000
Trade Show Participation:
ECOC 2001 Amsterdam; ECOC 2002 Copenhagen
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