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ASMPT AMICRA
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Company
Core Strengths
History
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Management
Horst Lapsien
Rudolf Kaiser
Dr. Johann Weinhändler
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Applications
SiPhotonics/PIC
3D IC, TSV and TCB
Active Optical Cable (AOC)
FanOut
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Products
Die Flip Chip Bonder
High Speed Dispense Systems
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Jobs
Process Engineer (Halbleitertechnik)
Senior Ingenieur für Inbetriebnahmen (w/m/d)
Service Engineer Semiconductor Equipment in Europa (w/m/d)
Produktionsleiter (w/m/d)
Konstrukteur (w/m/d)
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Die Flip Chip Bonder
CoS Die Bonder: High-precision chip-on-substrate bonding
AFC Plus - Die Bonder and Flip Chip Bonder
Nova Plus - Die Bonder and Flip Chip Bonder
NANO - Die Bonder and Flip Chip Bonder
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High Speed Dispense Systems
High Speed & Precision Dispensing System
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