ASMPT AMICRA
Back
Back
Back
Back
  • Products
  • Die Flip Chip Bonder
  • High Speed Dispense Systems
Back
Back

Panel-Level Heterogeneous Integration Technology for Analog ICs

31.08.2021

An article featuring ASM AMICRA's NOVA+ MTP System and X-Celeprint's MTP technology can be found in the Semiconductor Digest’s August/September 2021 issue, p. 9-11.

Other news

All news
Corporate Information
Industries
Solutions
Social Media
© ASMPT 2024 | Legal notice | Privacy Policy | Cookie Settings | General Terms and Conditions of Purchase

In order to be able to use all functions of this website,
either a login or a registration is necessary.

Login Register